Due to the rapid growth of the application demand of Image Sensor CIS, power management chip PMIC, fingerprint identification chip, Bluetooth chip, special memory chip and so on, 8-inch factory wafer orders are booming. It is reported that due to the shortage of OEM capacity, some IC design manufacturers disclosed that they had raised the price of new chips recently and informed customers to increase the OEM prices in the fourth quarter of this year and next year.
Wafer foundry production capacity is increasingly tight, the industry has been in a state of short supply, and has lasted for about a year. From the industry understanding, under normal circumstances, generally in the wafer factory after three or four months, to the seal test stage.
After trading on October 15, SMICs H-share announced that it would raise its income growth guidelines for the third quarter from 1% to 3% to 14% to 16%. Zhao Haijun, the joint CEO of SMIC, once said that in order to alleviate the shortage of supply, the companys 8-inch monthly production capacity will increase by 30000 pieces by the end of this year, and the 12 inch monthly production capacity will increase by 20000 pieces. SMICs stock price began to change in recent days. Since hitting a record low at the end of September, the cumulative rebound has reached more than 20%.
Wafer foundry and seal testing company
There are many links in the chip industry, and the degree of specialization is high. Manufacturing is the core link of the industry chain. The upstream and downstream of semiconductor industry chain includes three links: IC design, wafer manufacturing and processing, packaging test and application. According to the statistics of the securities times and data bank, there are relatively few A-share companies that have been deployed in the field of wafer foundry and package testing. There are about 23 companies, of which 15 are in the field of wafer foundry and 8 are in the field of packaging and testing.
In July, SMIC, which landed on the science and technology innovation board, is undoubtedly the leader in the field of wafer foundry. The companys advanced process has gradually made progress, 14 nm successful mass production, 28 nm and below (SMIC north, SMIC South) proportion continued to increase. In the field of chip packaging and testing, Changdian technology is the worlds leading semiconductor microsystem integration and packaging test service provider. According to the report of topu Industry Research Institute, in the first quarter of 2020, among the top ten IC packaging and testing enterprises in the world, Changdian technology ranked third in the world with 13.8% market share. From the perspective of secondary market performance, the stock prices of the companies in the above two fields have performed well, with an average increase of 73.04% since this year (excluding the first day of IPO in the year). Among them, Shanghai silicon industry, Longji shares, Jingfang technology, Yangjie technology and Fuman electronics have doubled in total. Shanghai silicon industry ranked first with a cumulative increase of 225.39%. Source: Securities Times editor in charge: Yang Bin_ NF4368
In July, SMIC, which landed on the science and technology innovation board, is undoubtedly the leader in the field of wafer foundry. The companys advanced process has gradually made progress, 14 nm successful mass production, 28 nm and below (SMIC north, SMIC South) proportion continued to increase.