Huawei Hisilicon launched 2021 doctoral recruitment involving multiple positions and chip types

category:Internet
 Huawei Hisilicon launched 2021 doctoral recruitment involving multiple positions and chip types


C114 news on September 30 (Andy) although facing severe challenges, Huawei Hisilicon recently announced that the 2021 doctoral recruitment is continuing.

The recruitment targets are doctoral candidates who graduated from universities at home and abroad from January 1, 2020 to December 31, 2021, and their working places include Beijing, Shanghai, Shenzhen, Dongguan, Wuhan, Xian, Chengdu, Hangzhou, Nanjing, Suzhou and other major cities in China.

The recruitment positions include: chip architecture engineer, processor development engineer, computing theory and Model Research Institute, ASIC Design Engineer, advanced semiconductor process development engineer, etc.; in the research field, storage and computing Integrated System Research Institute, storage algorithm engineer, security engineer, AI algorithm engineer, etc.; system category includes network technology research engineer System engineer; hardware includes RF system engineer and hardware technical engineer; software includes chip software architecture engineer.