In the latest regulations, Huaweis upstream chip supply chain is the focus of attack, including many links in the chip manufacturing process including wafer foundry. That is to say, every chip produced by Huawei in the future needs to be approved by the U.S. government, whether its mobile phone chip, server chip, power management chip, set-top box chip, whether its in China, South Korea or Japan.
According to the research of the industry organization xinmou, this means that all manufacturing companies in the world need to obtain the permission of the U.S. government if they want to use the chip and semiconductor designs produced by the relevant technologies and equipment in the U.S., which is not only a drain on Huawei, but also a drain on the whole high-tech industry in China.
If we cant get by now, there will be no long run. Gu Wenjun, chief researcher of the Research Institute, said.
So does Huawei have a way to deal with it?
This may start from the upstream of chip design.
Although Huaweis Hisilicon chip has reached the worlds top level in many fields after 20 years of development, it even leads the world in some fields. But the chip is the most hard core high-tech industry in the world, and the manufacturing process measured by nano meter is extremely complex, including chip design, chip manufacturing, chip seal testing, chip materials, chip equipment. The industrial chain involves more than 50 industries, and no country can achieve the independent control of the whole industrial chain.
Huawei Hisilicon is the leader in chip design. At present, Chinas semiconductor industry has reached a high level in design, packaging and complete machine. However, the bottom high-end equipment, EDA software and materials are mainly from the West.
At present, the worlds integrated circuit special equipment manufacturers are mainly concentrated in Europe, America, Japan, South Korea and Taiwan, etc., represented by applied materials, ASML in the Netherlands, lamresearch in the United States, Tokyo electron in Japan and KLA Tencor in the United States Well known enterprises started earlier and occupied the main share of the global IC equipment market.
From the perspective of the domestic semiconductor equipment market segments, the localization process of etching equipment is the fastest. The medium etching equipment of medium and micro semiconductors has reached the node of 7Nm process, becoming the only domestic equipment company among the five suppliers of TSMC 7Nm production line etching equipment. North Huachuang 28 nanometer silicon etching equipment has been mass produced, and 16 / 14 nanometer silicon etching equipment has entered the mainstream production line validation in China. But in the field of lithography, there is still a big gap with international manufacturers.
One of the experts in the industry has summarized the localization, from the terminal to the chip, to the chip design tools, then to the chip manufacturing and manufacturing equipment materials, and finally found that the original theoretical basis of materials, physics, chemistry and mathematics at the bottom of the equipment and materials are all the lessons to be supplemented by Chinas semiconductor industry.
However, from the perspective of global industry, modern science and technology products need to be highly specialized, that is to say, mature manufacturers have formed a high-efficiency and high-yield product manufacturing and delivery system, which provides customers with a large number of products at relatively low cost, which makes the manufacturing supply chain often difficult to concentrate in a certain country, and also difficult to move easily.
The U.S. attack on other semiconductor enterprises and its obsession with made in America return will not only affect the industrial chain of a single region. For semiconductor manufacturers, there may be only one cost to consider when setting up a factory 30 years ago, but now risk and supply chain resilience have become new options.
Source: Wang Fengzhi, editor in charge of the first financial daily_ NT2541